IEEE 1101.2 PDF

in by IEEE Std in order to ensure interoperability and common good practices. Thanks to this standard, conduction cooled boards and chassis. Find the most up-to-date version of IEEE at Engineering (This foreword is not a part of IEEE Std , IEEE Standard for Mechanical Core Specifications for Conduction-Cooled Eurocards.) This document.

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The circuit card module of claim 1wherein said frame extension comprises an integrated frame extension with the frame. Home About Help Search. The metal strip 5 acts both as a heatsink and as protection for the card 7 against damage when it is inserted and removed from the chassis 2.

The adapter of the present invention shown in FIG. The frame 1 is either adapted with another piece of material extension 16 to extend to the chassis 2 cold wall or is constructed of one piece frame 1 integrated with extension The net effect of these improvements are a reduction in the thermal resistance per inch of wedgelock length.

Generally, COTS circuit card modules comprises one or more printed wiring boards PWBat least one component mounted on the PWB, and a heatsink that creates a heat path from the component to the chassis, and a wedgelock for securing the module to the conduction-cooled chassis. The extended width wedgelock is mounted 1101.2 one surface of the frame such that when installed in a conduction-cooled chassis, the opposite frame surface is forced against the chassis cold wall.

Further, the frame 11 eliminates the need for the metal strip 5 of FIG. Wedgelock device for increased thermal conductivity of a printed wiring assembly. Similar to the embodiment of FIG. The particular values and configurations discussed above can be varied and are cited merely to illustrate a particular embodiment of the present invention and are not intended to limit the scope of the invention.

Also, the wedgelock 3 can be an extended width wedgelock as described above with respect to FIGS. By Clarence Peckham Conduction cooling of circuit cards is a technology that has 111.2 used for many years in the military marketplace. In the conduction-cooled configuration, the component heat is removed by conduction to the chassis cold wall.

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Conduction-Cooled PMC (CCPMC)

Create lists, bibliographies and reviews: The embodiment illustrated in FIG. In the convection-cooled configuration, air flow over the card is used to remove component heat. A card guide 18 is attached to the convection-cooled chassis 12 with for example, screws, for receiving the card 7 by its protrusion 4. Additionally, for IEEE High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact.

Conventional cooling methods utilized in off-the-shelf parts include normal convection, forced convection—such as fan cooling, liquid cooling, various forms of heat conductors or sinks, etc.

The circuit card module of claim 4wherein said wedgelock has a thermal resistance per inch of wedgelock length of no greater than 1 C. Thus, the surface contact area between the circuit card module is increased and the thermal performance improved without impacting the existing COTS design. As described above, the removal of the protrusion 4 allows for an increase in the width of the contact surface between the frame 1 and chassis 2 by from about 1101.

Obviously VME has been available for 20 years and long life is a key factor for military applications. Your list has reached the maximum number of items. Also similar to the embodiment of FIG.

These two effects reduce the efficiency of movement of the heat to the cold 101.2 of the chassis. Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between.

Find a copy in the library Finding libraries that hold this item Finding libraries that leee this item Circuit board, electronic circuit chip-mounted circuit board and circuit board apparatus. In a conduction-cooled chassis, on the other hand, the channel for receiving the protrusion 4 is machined into the chassis 2 itself as shown in FIGS.

But the driving force has been a standard developed by the IEEE. In the present invention, the wedgelock is mounted to one surface of the frame such that when installed in a conduction-cooled chassis, the opposite frame surface is forced against the chassis cold wall. This embodiment has a protrusion 14 and thus, is compliant with the IEEE Commercially-available, off-the-shelf components that are included in circuit card modules are often unreliable when exposed to the high temperatures present in, for example, the military environment.

An end portion of the circuit card 7 often includes a protrusion 4 often machined from base card 7which allows this module to be compliant with a convection-cooled chassis as defined in IEEE It is still a further object of the present invention to improve the cooling efficiency of the module through the use of an extended width larger wedgelock. This, in turn, reduces the module to chassis interface temperature rise. Document, Internet resource Document Type: Although the wedgelock 3 would most likely be used in practice, a larger wedgelock can also be used in this alternate embodiment.

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The following summary of the invention is provided to facilitate an understanding of some of the innovative features unique to the present invention, and is not intended to be a full description. You already recently rated this item.

In a convection-cooled chassis as shown in FIG. In particular, the frame 1 is extended with extension 16 to utilize the contact area 40 isee, the width of wedgelock 3 can be extended, and the strip 15 fully utilizes the space under the protrusion 4.

Other variations and modifications of the present invention will be apparent to those of skill in the art, and it is the intent of the appended claims that such variations and modifications be covered. Terms and 101.2 Terms of subscription Online watch.

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In order to comply with the IEEE The novel features of the present invention will become apparent to those of skill in the art upon examination of the following detailed description of the invention or can be learned by practice of the present invention.

Please choose whether or not you want other users to be able to see on your profile that this library is a favorite of yours. It is intended that the scope of the present invention be defined by the claims appended hereto.

Citations are based on reference standards. The first thermal path is through the lower surface of component 6 to the end of circuit card 7 to chassis cold wall 2 via metal strip 5 or shim. Your Web browser is not enabled for JavaScript.

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